Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088079 | Package structure having line connected via portions | Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2021-08-10 |
| 11011451 | Integrated circuit package and method | Yuan Sheng Chiu, Tsung-Shu Lin | 2021-05-18 |