Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201097 | Method of manufacture of a semiconductor device | Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11121050 | Method of manufacture of a semiconductor device | Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11101236 | Semiconductor package and method of forming the same | Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2021-08-24 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2021-07-27 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Li-Chung Kuo, Long Hua Lee, Szu-Wei Lu, Ying-Ching Shih | 2021-06-01 |
| 10985125 | Chip package structure | Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2021-04-20 |
| 10886147 | Package structure and method for forming the same | Sung-Hui Huang, Shang-Yun Hou | 2021-01-05 |