Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11134591 | Circuit board assemblies for electronic devices | Cheng-Sheng Chen | 2021-09-28 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2021-07-27 |
| 11042983 | Automatic brain infarction detection system on magnetic resonance imaging and operation method thereof | Jang-Zern Tsai, Syu-Jyun Peng, Meng-Zong Tsai, Kuo-Wei Wang, Yeh-Lin Kuo | 2021-06-22 |
| 11024616 | Package structure and method of manufacturing the same | Li-Chung Kuo, Long Hua Lee, Szu-Wei Lu, Ying-Ching Shih, Kuan-Yu Huang | 2021-06-01 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2021-04-20 |