Issued Patents 2021
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205612 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2021-12-21 |
| 11205629 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Shih-Ting Lin | 2021-12-21 |
| 11205615 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Ying-Ching Shih | 2021-12-21 |
| 11205579 | Molding wafer chamber | Jing-Cheng Lin, Chin-Chuan Chang, Jui-Pin Hung, Shin-Puu Jeng, Chen-Hua Yu | 2021-12-21 |
| 11164829 | Method of forming contact holes in a fan out package | Feng-Cheng Hsu, Jing-Cheng Lin | 2021-11-02 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Kuo-Chiang Ting, Shang-Yun Hou +3 more | 2021-11-02 |
| 11164824 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Kung-Chen Yeh, Li-Chung Kuo, Ying-Ching Shih | 2021-11-02 |
| 11152316 | Method of forming contact holes in a fan out package | Feng-Cheng Hsu, Jing-Cheng Lin | 2021-10-19 |
| 11152330 | Semiconductor package structure and method for forming the same | Cheng-Chieh Li, Pu Wang, Chih-Wei Wu, Ying-Ching Shih | 2021-10-19 |
| 11145562 | Package structure and method of manufacturing the same | Jung-Hua Chang, Chih-Wei Wu, Ying-Ching Shih | 2021-10-12 |
| 11139285 | Semiconductor package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Jing-Cheng Lin | 2021-10-05 |
| 11139260 | Plurality of stacked pillar portions on a semiconductor structure | Jung-Hua Chang, Ying-Ching Shih | 2021-10-05 |
| 11133282 | COWOS structures and methods forming same | Chen-Hua Yu | 2021-09-28 |
| 11133289 | Semiconductor package and manufacturing method of semiconductor package having plurality of encapsulating materials | Tsung-Fu Tsai, Shih-Ting Lin, Ying-Ching Shih | 2021-09-28 |
| 11133286 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2021-09-28 |
| 11121051 | Semiconductor packages and method of manufacturing the same | Li-Hui Cheng, Chin-Fu Kao, Chih-Chien Pan | 2021-09-14 |
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Tsung-Fu Tsai, Chen-Hsuan Tsai, Chung Chieh TING, Shih-Ting Lin | 2021-08-24 |
| 11101252 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Chin-Fu Kao, Jing-Cheng Lin, Li-Hui Cheng | 2021-08-24 |
| 11094635 | Package structure and method for forming the same | Chin-Chuan Chang | 2021-08-17 |
| 11094646 | Methods of manufacturing an integrated circuit having stress tuning layer | Shin-Puu Jeng, Clinton Chao | 2021-08-17 |
| 11094639 | Semiconductor package | Jing-Cheng Lin, Po-Hao Tsai, Ying-Ching Shih | 2021-08-17 |
| 11088086 | Chip package structure and method for forming the same | Jiun-Ting Chen, Ying-Ching Shih, Chih-Wei Wu | 2021-08-10 |
| 11081369 | Package structure and manufacturing method thereof | Li-Hui Cheng, Ping-Yin Hsieh, Chih-Hao Chen | 2021-08-03 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee +1 more | 2021-07-27 |
| 11062968 | Package structure and method for forming the same | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2021-07-13 |