Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145562 | Package structure and method of manufacturing the same | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2021-10-12 |
| 11139260 | Plurality of stacked pillar portions on a semiconductor structure | Szu-Wei Lu, Ying-Ching Shih | 2021-10-05 |
| 11114405 | Semiconductor package structure with twinned copper | Po-Hao Tsai, Jing-Cheng Lin | 2021-09-07 |
| 11004797 | Package structure, semiconductor package and method of fabricating the same | Chin-Fu Kao | 2021-05-11 |