Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205612 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2021-12-21 |
| 11121051 | Semiconductor packages and method of manufacturing the same | Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2021-09-14 |
| 11101252 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Jing-Cheng Lin, Li-Hui Cheng, Szu-Wei Lu | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11062968 | Package structure and method for forming the same | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2021-07-13 |
| 11031381 | Optical transceiver and manufacturing method thereof | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2021-06-08 |
| 11004797 | Package structure, semiconductor package and method of fabricating the same | Jung-Hua Chang | 2021-05-11 |