Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205629 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Szu-Wei Lu | 2021-12-21 |
| 11133289 | Semiconductor package and manufacturing method of semiconductor package having plurality of encapsulating materials | Tsung-Fu Tsai, Szu-Wei Lu, Ying-Ching Shih | 2021-09-28 |
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Tsung-Fu Tsai, Chen-Hsuan Tsai, Chung Chieh TING, Szu-Wei Lu | 2021-08-24 |
| 11101252 | Package-on-package structure and manufacturing method thereof | Chin-Fu Kao, Jing-Cheng Lin, Li-Hui Cheng, Szu-Wei Lu | 2021-08-24 |
| 11056436 | Integrated fan-out structure with rugged interconnect | Szu-Wei Lu, Jing-Cheng Lin, Chen-Hua Yu | 2021-07-06 |
| 11009551 | Device and method of analyzing transistor and non-transitory computer readable medium | — | 2021-05-18 |
| 10985140 | Structure and formation method of package structure with underfill | Chen-Hsuan Tsai, Tsung-Fu Tsai, Szu-Wei Lu | 2021-04-20 |
| 10923438 | Package structure and method for forming the same | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Szu-Wei Lu | 2021-02-16 |