Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164824 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih | 2021-11-02 |
| 10923438 | Package structure and method for forming the same | Tsung-Fu Tsai, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2021-02-16 |