Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205629 | Package structure and method of fabricating the same | Shih-Ting Lin, Szu-Wei Lu | 2021-12-21 |
| 11164824 | Package structure and method of fabricating the same | Kung-Chen Yeh, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih | 2021-11-02 |
| 11133289 | Semiconductor package and manufacturing method of semiconductor package having plurality of encapsulating materials | Shih-Ting Lin, Szu-Wei Lu, Ying-Ching Shih | 2021-09-28 |
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Chen-Hsuan Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2021-08-24 |
| 10985140 | Structure and formation method of package structure with underfill | Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2021-04-20 |
| 10923438 | Package structure and method for forming the same | Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2021-02-16 |