Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Tsung-Fu Tsai, Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2021-08-24 |