Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101145 | Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material | Tsung-Fu Tsai, Chung Chieh TING, Shih-Ting Lin, Szu-Wei Lu | 2021-08-24 |
| 10985140 | Structure and formation method of package structure with underfill | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu | 2021-04-20 |