Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11164824 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2021-11-02 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2021-08-24 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2021-07-27 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Long Hua Lee, Szu-Wei Lu, Ying-Ching Shih, Kuan-Yu Huang | 2021-06-01 |