Issued Patents 2021
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205615 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2021-12-21 |
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11183482 | Shift control method in manufacture of semiconductor device | Ying-Ching Shih, Hsien-Ju Tsou | 2021-11-23 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Kuo-Chiang Ting, Szu-Wei Lu, Shang-Yun Hou +3 more | 2021-11-02 |
| 11152330 | Semiconductor package structure and method for forming the same | Cheng-Chieh Li, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2021-10-19 |
| 11145562 | Package structure and method of manufacturing the same | Jung-Hua Chang, Szu-Wei Lu, Ying-Ching Shih | 2021-10-12 |
| 11139285 | Semiconductor package | Hsien-Ju Tsou, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2021-10-05 |
| 11133286 | Chip packages and methods of manufacture thereof | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2021-09-28 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11088086 | Chip package structure and method for forming the same | Jiun-Ting Chen, Ying-Ching Shih, Szu-Wei Lu | 2021-08-10 |
| 10930701 | Light-emitting element having a plurality of light-emitting structures | Chen Ou, Chun-Wei Chang, Sheng-Chih WANG, Hsin-Mei Tsai, Chia-Chen Tsai +1 more | 2021-02-23 |
| 10916450 | Package of integrated circuits having a light-to-heat-conversion coating material | Hsien-Ju Tsou, Pu Wang, Szu-Wei Lu, Ying-Ching Shih, Jing-Cheng Lin | 2021-02-09 |