Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Szu-Wei Lu, Shang-Yun Hou +3 more | 2021-11-02 |
| 11156772 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Pin-Tso Lin, Sung-Hui Huang, Shang-Yun Hou +1 more | 2021-10-26 |
| 11139282 | Semiconductor package structure and method for manufacturing the same | Tu-Hao Yu, Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Wan-Yu Lee +1 more | 2021-10-05 |
| 10978352 | FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuang-Hsin Chen | 2021-04-13 |