Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Chi-Hsi Wu, Chih-Wei Wu, Kuo-Chiang Ting, Szu-Wei Lu, Shang-Yun Hou +3 more | 2021-11-02 |
| 11139282 | Semiconductor package structure and method for manufacturing the same | Kuo-Chiang Ting, Tu-Hao Yu, Ting-Yu Yeh, Chia-Hao Hsu, Wan-Yu Lee +1 more | 2021-10-05 |
| 11065564 | Pressure control device | Takeshi Nakano, Yoshinori Yamaki, Tomohiro Yasuda, Kenta KURAMOCHI | 2021-07-20 |
| 11069467 | Solenoid device | Kenta KURAMOCHI, Tomohiro Yasuda | 2021-07-20 |
| 10907741 | Control valve device | Tomohiro Yasuda, Kenta KURAMOCHI, Takanori Ara | 2021-02-02 |