Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139282 | Semiconductor package structure and method for manufacturing the same | Kuo-Chiang Ting, Tu-Hao Yu, Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen +1 more | 2021-10-05 |
| 11125940 | Method of fabrication polymer waveguide | Chun-Hao Tseng, Hai-Ching Chen, Tien-I Bao | 2021-09-21 |
| 11088094 | Air channel formation in packaging process | Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu | 2021-08-10 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Sao-Ling Chiu, Shang-Yun Hou | 2021-04-13 |