Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11179040 | Attachable monitoring device | Shih-Chien Lin, Ho-Yi Chang, Kai-Chieh Chang | 2021-11-23 |
| 11125940 | Method of fabrication polymer waveguide | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2021-09-21 |
| 11088058 | Method for forming semiconductor package using carbon nano material in molding compound | Ying-Hao Kuo, Kuo-Chung Yee | 2021-08-10 |
| 10983278 | Adhesion promoter apparatus and method | Ying-Hao Kuo, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2021-04-20 |
| 10957559 | Thermally conductive structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2021-03-23 |