Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049811 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Jung-Hsun Tsai, Hsin-Yen Huang, Hai-Ching Chen, Tien-I Bao | 2021-06-29 |
| 10983278 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2021-04-20 |