Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189560 | Semiconductor device comprising etch stop layer over dielectric layer and method of manufacture | Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2021-11-30 |
| 11125940 | Method of fabrication polymer waveguide | Chun-Hao Tseng, Wan-Yu Lee, Tien-I Bao | 2021-09-21 |
| 11081447 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Yu-Chen Chan, Ming-Han Lee, Shau-Lin Shue | 2021-08-03 |
| 11075113 | Metal capping layer and methods thereof | Shao-Kuan Lee, Cheng-Chin Lee, Hsin-Yen Huang, Shau-Lin Shue | 2021-07-27 |
| 11069526 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Cheng-Chin Lee, Shau-Lin Shue | 2021-07-20 |
| 11049811 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Jung-Hsun Tsai, Kai-Fang Cheng, Hsin-Yen Huang, Tien-I Bao | 2021-06-29 |
| 11004740 | Structure and method for interconnection with self-alignment | Tai-I Yang, Yu-Chieh Liao, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue | 2021-05-11 |
| 10983278 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Kai-Fang Cheng, Tien-I Bao | 2021-04-20 |
| 10943867 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2021-03-09 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang +2 more | 2021-02-23 |