Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183422 | Semiconductor structure and method for manufacturing the same | Wei-Chen Chu, Hsin-Ping Chen, Chih Wei Lu, Chung-Ju Lee | 2021-11-23 |
| 11167984 | Nano-electromechanical system (NEMS) device structure and method for forming the same | Hsin-Ping Chen, Carlos H. Diaz, Ken-Ichi Goto, Shau-Lin Shue | 2021-11-09 |
| 11107725 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Wei-Chen Chu, Chia-Tien Wu | 2021-08-31 |
| 11101216 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2021-08-24 |
| 11088020 | Structure and formation method of interconnection structure of semiconductor device | Wei-Chen Chu, Li-Lin Su, Shin-Yi Yang, Cheng-Chi Chuang, Hsin-Ping Chen | 2021-08-10 |
| 11011462 | Method for forming fuse pad and bond pad of integrated circuit | Chun-Yi Yang, Chih-Hao Lin, Hong-Seng Shue, Ruei-Hung Jang | 2021-05-18 |
| 11004740 | Structure and method for interconnection with self-alignment | Yu-Chieh Liao, Chia-Tien Wu, Hsin-Ping Chen, Hai-Ching Chen, Shau-Lin Shue | 2021-05-11 |
| 10991618 | Semiconductor device and method of manufacture | Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue | 2021-04-27 |
| 10964559 | Wafer etching apparatus and method for controlling etch bath of wafer | Chih-Shen Yang, Tien-Lu Lin | 2021-03-30 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Chia-Tien Wu +2 more | 2021-02-23 |
| 10923424 | Interconnect structure with air-gaps | Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin | 2021-02-16 |