Issued Patents 2021
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201085 | Semiconductor device structure having air gap and method for forming the same | Chia-Lin Chuang, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2021-12-14 |
| 11195934 | Structure and method for bi-layer self-aligned contact | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2021-12-07 |
| 11177383 | Semiconductor device structure and method for forming the same | Chia-Hao Chang, Sheng-Tsung Wang, Lin-Yu Huang, Chia-Lin Chuang, Yu-Ming Lin +1 more | 2021-11-16 |
| 11159164 | Integrated circuit and method of manufacturing the same | Shih-Wei Peng, Chih-Ming Lai, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2021-10-26 |
| 11158580 | Semiconductor devices with backside power distribution network and frontside through silicon via | Kam-Tou Sio, Chia-Tien Wu, Jiann-Tyng Tzeng, Shih-Wei Peng, Wei-Cheng Lin | 2021-10-26 |
| 11152475 | Method for forming source/drain contacts utilizing an inhibitor | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2021-10-19 |
| 11145728 | Semiconductor device and method of forming same | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2021-10-12 |
| 11121138 | Low resistance pickup cells for SRAM | Yi-Hsun Chiu, Shang-Wen Chang | 2021-09-14 |
| 11094788 | Semiconductor device and manufacturing method thereof | Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2021-08-17 |
| 11088020 | Structure and formation method of interconnection structure of semiconductor device | Tai-I Yang, Wei-Chen Chu, Li-Lin Su, Shin-Yi Yang, Hsin-Ping Chen | 2021-08-10 |
| 11018157 | Local interconnect structure | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +5 more | 2021-05-25 |
| 10937884 | Gate spacer with air gap for semiconductor device structure and method for forming the same | Sheng-Tsung Wang, Lin-Yu Huang, Chia-Lin Chuang, Chia-Hao Chang, Yu-Ming Lin +1 more | 2021-03-02 |
| 10930595 | Standard cells having via rail and deep via structures | Wei-Cheng Lin, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Wayne Lai | 2021-02-23 |
| 10923424 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2021-02-16 |