Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11183422 | Semiconductor structure and method for manufacturing the same | Tai-I Yang, Hsin-Ping Chen, Chih Wei Lu, Chung-Ju Lee | 2021-11-23 | $16,214,000 |
| 11107725 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Chia-Tien Wu, Tai-I Yang | 2021-08-31 | $13,167,000 |
| 11088020 | Structure and formation method of interconnection structure of semiconductor device | Tai-I Yang, Li-Lin Su, Shin-Yi Yang, Cheng-Chi Chuang, Hsin-Ping Chen | 2021-08-10 | $8,867,000 |
| 10991618 | Semiconductor device and method of manufacture | Tai-I Yang, Yung-Chih Wang, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue | 2021-04-27 | $19,041,000 |
| 10957580 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Chia-Tien Wu | 2021-03-23 | $18,734,000 |