Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158580 | Semiconductor devices with backside power distribution network and frontside through silicon via | Kam-Tou Sio, Cheng-Chi Chuang, Jiann-Tyng Tzeng, Shih-Wei Peng, Wei-Cheng Lin | 2021-10-26 |
| 11107725 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Wei-Chen Chu, Tai-I Yang | 2021-08-31 |
| 11018157 | Local interconnect structure | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang +5 more | 2021-05-25 |
| 11004740 | Structure and method for interconnection with self-alignment | Tai-I Yang, Yu-Chieh Liao, Hsin-Ping Chen, Hai-Ching Chen, Shau-Lin Shue | 2021-05-11 |
| 10991618 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Hsin-Ping Chen, Shau-Lin Shue | 2021-04-27 |
| 10957580 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Wei-Chen Chu | 2021-03-23 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang +2 more | 2021-02-23 |