Issued Patents 2021
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171089 | Line space, routing and patterning methodology | Shih-Wei Peng, Chih-Ming Lai, Wei-Cheng Lin | 2021-11-09 |
| 11159164 | Integrated circuit and method of manufacturing the same | Shih-Wei Peng, Cheng-Chi Chuang, Chih-Ming Lai, Wei-Cheng Lin | 2021-10-26 |
| 11158580 | Semiconductor devices with backside power distribution network and frontside through silicon via | Kam-Tou Sio, Cheng-Chi Chuang, Chia-Tien Wu, Shih-Wei Peng, Wei-Cheng Lin | 2021-10-26 |
| 11152348 | Integrated circuit with mixed row heights | Kam-Tou Sio, Jack Liu, Yi-Chuin Tsai, Shang-Wei Fang, Sing-Kai Huang +1 more | 2021-10-19 |
| 11145678 | Method for manufacturing semiconductor device | Jack Liu, Chih-Liang Chen, CHEW-YUEN YOUNG, Sing-Kai Huang, Ching-Fang Huang | 2021-10-12 |
| 11139245 | Advanced node interconnect routing methodology | Shih-Wei Peng | 2021-10-05 |
| 11133255 | Metal patterning for internal cell routing | Shih-Wei Peng, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Wei-Cheng Lin | 2021-09-28 |
| 11133254 | Hybrid power rail structure | Wei-An Lai, Wei-Cheng Lin | 2021-09-28 |
| 11126775 | IC layout, method, device, and system | Shih-Wei Peng, Guo-Huei Wu, Wei-Cheng Lin, Hui-Zhong Zhuang | 2021-09-21 |
| 11121256 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Lei-Chun Chou, Jack Liu, Kam-Tou Sio, Hui-Ting Yang +3 more | 2021-09-14 |
| 11100273 | Integrated circuit and method of manufacturing same | Shih-Wei Peng, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Zhong Zhuang, Shun Li Chen +1 more | 2021-08-24 |
| 11088092 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-08-10 |
| 11080454 | Integrated circuit, system, and method of forming the same | Shih-Wei Peng, Chih-Ming Lai | 2021-08-03 |
| 11063005 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-07-13 |
| 11055469 | Power structure with power pick-up cell connecting to buried power rail | Shih-Wei Peng, Wei-Cheng Lin | 2021-07-06 |
| 11048848 | Semiconductor device including region having both continuous regions, and method and system for generating layout diagram of same | Shih-Wei Peng, Chun-Hung Liou | 2021-06-29 |
| 11043426 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +4 more | 2021-06-22 |
| 11024580 | Random cut patterning | Shih-Wei Peng, Wei-Cheng Lin, Chih-Ming Lai | 2021-06-01 |
| 11024579 | Dual power structure with connection pins | Shih-Wei Peng, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-06-01 |
| 11018157 | Local interconnect structure | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +5 more | 2021-05-25 |
| 10977417 | Semiconductor structure, device, and method | Shih-Wei Peng, Wei-Cheng Lin | 2021-04-13 |
| 10977421 | System for and method of manufacturing an integrated circuit | Wei-Cheng Lin, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Kam-Tou Sio +3 more | 2021-04-13 |
| 10971493 | Integrated circuit device with high mobility and system of forming the integrated circuit | Kam-Tou Sio, Shang-Wei Fang, CHEW-YUEN YOUNG | 2021-04-06 |
| 10964684 | Multiple fin height integrated circuit | Wei-Cheng Lin, Hui-Ting Yang, Lipen Yuan, Wei-An Lai | 2021-03-30 |
| 10950456 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng +6 more | 2021-03-16 |