Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081354 | Fin patterning methods for increased process margins | Wei-Liang Lin, Li-Te Lin, Ru-Gun Liu, Min Cao | 2021-08-03 |
| 10971363 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Wei-Liang Lin, Ru-Gun Liu | 2021-04-06 |
| 10957551 | Fin-like field effect transistor patterning methods for increasing process margins | Wei-Liang Lin, Hsin-Chih Chen, Shi Ning Ju, Ken-Hsien Hsieh, Yung-Sung Yen +1 more | 2021-03-23 |
| 10950456 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Hsin-Chih Chen +6 more | 2021-03-16 |