Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121256 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Jack Liu, Kam-Tou Sio, Hui-Ting Yang, Wei-Cheng Lin +3 more | 2021-09-14 |
| 11018157 | Local interconnect structure | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +5 more | 2021-05-25 |
| 10950456 | High-density semiconductor device | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng, Hsin-Chih Chen +6 more | 2021-03-16 |