Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11150561 | Method and apparatus for collecting information used in image-error compensation | Hung-Wen Cho, Fu-Jye Liang, Chih-Tsung Shih, Li-Jui Chen, Po-Chung Cheng +1 more | 2021-10-19 |
| 11121128 | Structure and method for alignment marks | Ming-Chang Wen, Hsien-Cheng Wang | 2021-09-14 |
| 11088092 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chih-Liang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu +3 more | 2021-08-10 |
| 11063005 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chih-Liang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu +3 more | 2021-07-13 |
| 11043426 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2021-06-22 |
| 11024579 | Dual power structure with connection pins | Shih-Wei Peng, Chih-Ming Lai, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +3 more | 2021-06-01 |
| 11024623 | Layout modification method for exposure manufacturing process | Hung-Wen Cho, Fu-Jye Liang, Chih-Tsung Shih, Li-Jui Chen, Po-Chung Cheng +1 more | 2021-06-01 |