Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133254 | Hybrid power rail structure | Jiann-Tyng Tzeng, Wei-Cheng Lin | 2021-09-28 |
| 11018157 | Local interconnect structure | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +5 more | 2021-05-25 |
| 10964684 | Multiple fin height integrated circuit | Wei-Cheng Lin, Hui-Ting Yang, Jiann-Tyng Tzeng, Lipen Yuan | 2021-03-30 |