Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152306 | Dielectric film for semiconductor fabrication | Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more | 2021-10-19 |
| 11107725 | Interconnect structure and manufacturing method for the same | Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang | 2021-08-31 |
| 11101216 | Metal line structure and method | Hsiang-Lun Kao, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2021-08-24 |
| 10957540 | Semiconductor epitaxy bordering isolation structure | Wen-Chin Chen, Cheng-Yi Wu, Yu-Hung Cheng, Ren-Hua Guo, Chin-Szu Lee | 2021-03-23 |
| 10957580 | Metal routing with flexible space formed using self-aligned spacer patterning | Chia-Tien Wu, Wei-Chen Chu | 2021-03-23 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Tai-I Yang, Chia-Tien Wu +2 more | 2021-02-23 |