Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189560 | Semiconductor device comprising etch stop layer over dielectric layer and method of manufacture | Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Cheng-Chin Lee | 2021-11-30 |
| 11075113 | Metal capping layer and methods thereof | Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2021-07-27 |
| 11069526 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Hsin-Yen Huang, Yung-Hsu Wu, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2021-07-20 |
| 10930551 | Methods for fabricating a low-resistance interconnect | Hsin-Yen Huang, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu +2 more | 2021-02-23 |