Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152295 | Semiconductor package structure and method for manufacturing the same | Chien-Kuo Chang, Tzu-Kai Lan, Hui-Ting Lin, Chun-Min LIN | 2021-10-19 |
| 11101272 | DRAM and method for manufacturing the same | — | 2021-08-24 |
| 11088109 | Packages with multi-thermal interface materials and methods of fabricating the same | Chien-Kuo Chang, Pu-Sheng Lee, Fu-Jen Li, Hsien-Liang Meng | 2021-08-10 |
| 11067608 | Current sensor and frequency compensation method thereof | Chih-Wen Lu, Jhih-Siou Cheng, Chieh-An Lin | 2021-07-20 |
| 11018182 | Pixel structure | Yi-Jyun Chen, Li-Cheng Yang, Yu-Chun Lee, Shiou-Yi KUO | 2021-05-25 |
| 11011431 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chien-Kuo Chang, Jung-Tsung Cheng, Kuan-Lin Ho | 2021-05-18 |
| 11011487 | Semiconductor package having varying conductive pad sizes | Chien-Kuo Chang, Tzu-Kai Lan, Chung-Chih Chen, Jr-Lin Hsu | 2021-05-18 |
| 11011462 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Chun-Yi Yang, Hong-Seng Shue, Ruei-Hung Jang | 2021-05-18 |