Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152295 | Semiconductor package structure and method for manufacturing the same | Chih-Hao Lin, Chien-Kuo Chang, Hui-Ting Lin, Chun-Min LIN | 2021-10-19 |
| 11011487 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Chien-Kuo Chang, Chung-Chih Chen, Jr-Lin Hsu | 2021-05-18 |