Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152295 | Semiconductor package structure and method for manufacturing the same | Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Hui-Ting Lin | 2021-10-19 |
CL
Chun-Min LIN
Overall (2021): #498,489 of 548,734Top 95%
1
Patents 2021