Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11165019 | ReRAM structure and method of fabricating the same | Shih-Min Chou, Kuo-Chih Lai, Wei-Ming Hsiao, Szu-Yao Yu, Nien-Ting Ho +2 more | 2021-11-02 |
| 11152295 | Semiconductor package structure and method for manufacturing the same | Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Chun-Min LIN | 2021-10-19 |