Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152295 | Semiconductor package structure and method for manufacturing the same | Chih-Hao Lin, Tzu-Kai Lan, Hui-Ting Lin, Chun-Min LIN | 2021-10-19 |
| 11088109 | Packages with multi-thermal interface materials and methods of fabricating the same | Chih-Hao Lin, Pu-Sheng Lee, Fu-Jen Li, Hsien-Liang Meng | 2021-08-10 |
| 11011431 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chih-Hao Lin, Jung-Tsung Cheng, Kuan-Lin Ho | 2021-05-18 |
| 11011487 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Tzu-Kai Lan, Chung-Chih Chen, Jr-Lin Hsu | 2021-05-18 |