PL

Pu-Sheng Lee

TSMC: 1 patents #1,794 of 3,494Top 55%
📍 Zhubei City, TW: #70 of 214 inventorsTop 35%
Overall (2021): #298,232 of 548,734Top 55%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11088109 Packages with multi-thermal interface materials and methods of fabricating the same Chih-Hao Lin, Chien-Kuo Chang, Fu-Jen Li, Hsien-Liang Meng 2021-08-10