Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211261 | Package structures and methods for forming the same | Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2021-12-28 |
| 11088109 | Packages with multi-thermal interface materials and methods of fabricating the same | Chih-Hao Lin, Chien-Kuo Chang, Pu-Sheng Lee, Fu-Jen Li | 2021-08-10 |