Issued Patents 2021
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211261 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Chung-Shi Liu +1 more | 2021-12-28 |
| 11201079 | Wafer chuck | Sih-Hao Liao, Chen-Hua Yu, Yu-Hsiang Hu, Wei-Chih Chen | 2021-12-14 |
| 11189521 | Methods of manufacturing redistribution circuit structures using phase shift mask | Chun-Chieh Wang, Jaw-Jung Shin, Ming-Tan Lee | 2021-11-30 |
| 11177165 | Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide | Zi-Jheng Liu, Yu-Hsiang Hu | 2021-11-16 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hui-Jung Tsai +1 more | 2021-11-09 |
| 11171098 | Package and manufacturing method thereof | Tian Hu, Yu-Hsiang Hu | 2021-11-09 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang, Yung-Chi Chu +1 more | 2021-11-02 |
| 11164814 | Package structure and method of manufacturing the same | Yung-Chi Chu, Yu-Hsiang Hu, Wei-Chih Chen | 2021-11-02 |
| 11158600 | Lithography process for semiconductor packaging and structures resulting therefrom | Ming-Tan Lee, Ting-Yang Yu, Shih-Peng Tai, I-Chia Chen | 2021-10-26 |
| 11158775 | Semiconductor device and method | Chen-Hua Yu, Keng-Han Lin, Hui-Jung Tsai | 2021-10-26 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2021-10-19 |
| 11143965 | Optical lithography system for patterning semiconductor devices and method of using the same | Ting-Yang Yu, Ming-Tan Lee | 2021-10-12 |
| 11145560 | Semiconductor device and methods of manufacturing | Hsing-Chieh Lee, Ming-Tan Lee | 2021-10-12 |
| 11133265 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Yi-Wen Wu | 2021-09-28 |
| 11127701 | Method of manufacturing intergrated fan-out package with redistribution structure | Hui-Jung Tsai, Jyun-Siang Peng | 2021-09-21 |
| 11127688 | Semiconductor package and manufacturing method thereof | Zi-Jheng Liu, Ming-Tan Lee | 2021-09-21 |
| 11121006 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Po-Han Wang, Yu-Hsiang Hu | 2021-09-14 |
| 11121299 | Semiconductor device and method | Tian Hu, Yu-Hsiang Hu, Chen-Hua Yu | 2021-09-14 |
| 11121106 | Integrated circuit package and method | Chia-Wei Wang, Hui-Jung Tsai, Yu-Tzu Chang | 2021-09-14 |
| 11114407 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2021-09-07 |
| 11101176 | Method of fabricating redistribution circuit structure | Po-Han Wang, Yu-Hsiang Hu | 2021-08-24 |
| 11088068 | Semiconductor packages and methods of manufacturing the same | Hui-Jung Tsai, Keng-Han Lin, Jyun-Siang Peng | 2021-08-10 |
| 11062915 | Redistribution structures for semiconductor packages and methods of forming the same | Yu-Hsiang Hu, Chen-Hua Yu | 2021-07-13 |
| 11056412 | Semiconductor package and manufacturing method thereof | Shih-Hao Tseng, Ming-Che Ho, Chia-Hung Liu | 2021-07-06 |
| 11049812 | Semiconductor devices and methods of forming the same | Sih-Hao Liao, Yu-Hsiang Hu, Meng-Che Tu | 2021-06-29 |