Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177165 | Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide | Yu-Hsiang Hu, Hung-Jui Kuo | 2021-11-16 |
| 11127688 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Ming-Tan Lee | 2021-09-21 |
| 11037877 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Ming-Tan Lee | 2021-06-15 |
| 11031351 | Method of manufacturing a semiconductor device | Jo-Lin Lan, Yu-Hsiang Hu, Hung-Jui Kuo | 2021-06-08 |
| 10937688 | Semiconductor package and method of fabricating semiconductor package | Chen-Cheng Kuo, Hung-Jui Kuo | 2021-03-02 |