Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2021-08-10 |
| 10937688 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2021-03-02 |