Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2021-08-10 |
YC
Yao-Chun Chuang
Overall (2021): #206,372 of 548,734Top 40%
1
Patents 2021