Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Yao-Chun Chuang +1 more | 2021-08-10 |
HL
Hao-Juin Liu
Overall (2021): #439,900 of 548,734Top 85%
1
Patents 2021