Issued Patents 2021
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2021-10-19 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2021-09-28 |
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Pei-Haw Tsao, Cheng-Hung Tsai, Kuo-Chin Chang, Li-Huan Chu | 2021-09-21 |
| 11127703 | Semiconductor devices | Chin-Yu Ku, Cheng-Lung Yang, Hon-Lin Huang, Chao-Yi Wang, Ching-Hui Chen +1 more | 2021-09-21 |
| 11094776 | Structure and formation method of semiconductor device with magnetic element covered by polymer material | Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Hon-Lin Huang +2 more | 2021-08-17 |
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2021-08-10 |
| 11081459 | Semiconductor device | Chin-Yu Ku, Hon-Lin Huang, Chao-Yi Wang, Chien-Hung Kuo | 2021-08-03 |
| 11043462 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo | 2021-06-22 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chung-Shi Liu | 2021-06-01 |
| 11018086 | Passive devices in package-on-package structures and methods for forming the same | Chih-Hua Chen | 2021-05-25 |
| 10985114 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2021-04-20 |
| 10978433 | Package-on-package (PoP) device with integrated passive device in a via | Ching-Wen Hsiao | 2021-04-13 |
| 10964610 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2021-03-30 |