Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Pei-Haw Tsao, Chen-Shien Chen, Cheng-Hung Tsai, Kuo-Chin Chang | 2021-09-21 |
| 11101190 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2021-08-24 |
| 11081392 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Jun He, Pei-Haw Tsao | 2021-08-03 |
| 10912194 | Printed circuit board | Pei-Haw Tsao, Tsung-Hsing Lu | 2021-02-02 |
| 10892230 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Pei-Haw Tsao | 2021-01-12 |