Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101190 | Package and printed circuit board attachment | Pei-Haw Tsao, Li-Huan Chu | 2021-08-24 |
| 11081392 | Dicing method for stacked semiconductor devices | Jun He, Li-Huan Chu, Pei-Haw Tsao | 2021-08-03 |
| 10912194 | Printed circuit board | Pei-Haw Tsao, Li-Huan Chu | 2021-02-02 |
| 10892230 | Magnetic shielding material with insulator-coated ferromagnetic particles | Pei-Haw Tsao, Li-Huan Chu | 2021-01-12 |