Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164764 | Carrier tape system and methods of using carrier tape system | Tsung-Jen Liao, Tsui-Mei Chen | 2021-11-02 |
| 11164763 | Carrier tape system and methods of using carrier tape system | Tsung-Jen Liao, Tsui-Mei Chen | 2021-11-02 |
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Chen-Shien Chen, Cheng-Hung Tsai, Kuo-Chin Chang, Li-Huan Chu | 2021-09-21 |
| 11101190 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2021-08-24 |
| 11081392 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Jun He, Li-Huan Chu | 2021-08-03 |
| 11037849 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2021-06-15 |
| 11018099 | Semiconductor structure having a conductive bump with a plurality of bump segments | An Xu, Huang-Ting Hsiao, Kuo-Chin Chang | 2021-05-25 |
| 10912194 | Printed circuit board | Tsung-Hsing Lu, Li-Huan Chu | 2021-02-02 |
| 10892230 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Li-Huan Chu | 2021-01-12 |