Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189538 | Semiconductor structure with polyimide packaging and manufacturing method | Chih-Fan Huang, Mao-Nan Wang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2021-11-30 |
| 11145564 | Multi-layer passivation structure and method | Chih-Fan Huang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2021-10-12 |
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Pei-Haw Tsao, Chen-Shien Chen, Cheng-Hung Tsai, Li-Huan Chu | 2021-09-21 |
| 11018099 | Semiconductor structure having a conductive bump with a plurality of bump segments | Pei-Haw Tsao, An Xu, Huang-Ting Hsiao | 2021-05-25 |
| 10985124 | Semiconductor structure and manufacturing method thereof | Yen-Kun Lai, Kuo-Ching Hsu, Mirng-Ji Lii | 2021-04-20 |