Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189538 | Semiconductor structure with polyimide packaging and manufacturing method | Chih-Fan Huang, Mao-Nan Wang, Kuo-Chin Chang, Hui-Chi Chen, Yen-Ming Chen | 2021-11-30 |
| 11145564 | Multi-layer passivation structure and method | Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Yen-Ming Chen | 2021-10-12 |
| 11114373 | Metal-insulator-metal structure | Yuan-Yang Hsiao, Hsiang-Ku Shen | 2021-09-07 |
| 11081445 | Semiconductor device comprising air gaps having different configurations | Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Li-Yu Lee, Tai-Yang Wu | 2021-08-03 |
| 11056556 | Metal-insulator-metal capacitive structure and methods of fabricating thereof | Hsiang-Ku Shen, Ming-Hong Kao, Hui-Chi Chen, Yen-Ming Chen | 2021-07-06 |
| 11031325 | Low-stress passivation layer | Hsiang-Ku Shen, Chun-Li Lin | 2021-06-08 |
| 11031458 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen +1 more | 2021-06-08 |