Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189538 | Semiconductor structure with polyimide packaging and manufacturing method | Mao-Nan Wang, Kuo-Chin Chang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2021-11-30 |
| 11145564 | Multi-layer passivation structure and method | Hui-Chi Chen, Kuo-Chin Chang, Dian-Hau Chen, Yen-Ming Chen | 2021-10-12 |
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2021-07-06 |
| 11031458 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen, Dian-Hau Chen +1 more | 2021-06-08 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2021-03-16 |