Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145592 | Process for forming metal-insulator-metal structures | Jian-Ming Huang, Han-Yi Chen, Ecko Lu, Hsiang-Yu Tsai, Chih-Hung Lu +1 more | 2021-10-12 |
| 11133304 | Packaging scheme involving metal-insulator-metal capacitor | Ying-Ju Chen, Hsien-Wei Chen | 2021-09-28 |
| 11114373 | Metal-insulator-metal structure | Yuan-Yang Hsiao, Dian-Hau Chen | 2021-09-07 |
| 11056556 | Metal-insulator-metal capacitive structure and methods of fabricating thereof | Ming-Hong Kao, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2021-07-06 |
| 11031325 | Low-stress passivation layer | Chun-Li Lin, Dian-Hau Chen | 2021-06-08 |